TFDS- 462U

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TFDS- 462U

TWO CHAMBERS THIN FILM DEPOSITION SYSTEM TFDS-462U

Deposition System TFDS-462U for coating thin films of metals on substrate materials such as metals, semiconductors or glass. Control console with system instrumentation are mounted in a common frame.The system is built on self contain frame, Clean Room Through the Wall design, full assembled and shipped in one piece to decrease installation time, in addition to the reduce foot print essential for clean room application.

Module A:
High Vacuum Evaporation System

  • E-gun process chamber
  • 4 up to 8 material pockets
  • Ion Gun for pre-cleaning
  • Assisted evaporation
  • Stainless steel water-cooled chamber
  • Built-in vacuum pumping system
  • High temperature substrate holder

Module B:
High Vacuum Sputtering System

  • Three magnetron sputter sources  
  • Ion Gun for pre-cleaning
  • High temperature substrate holder

Module C:
Transfer / Load lock System

  • Handles up to 4 inch diameter substrate
  • Direct in vacuum loading in any of the chambers
  • Transfers in vacuum from one to other chamber

ALTERNATIVE CONFIGURATIONS:

  • Two evaporation chambers
  • Two sputtering chambers
  • Organic deposition chamber with up to eight low temperatures in any combination
  • Turbomolecular pumps instead cryogenics pumps
  • With and without transfer chamber
  • Size and quantity of substrates according to client request

EVAPORATION CHAMBER ALTERNATIVE CONFIGURATIONS:

  • Additional thermal evaporation sources
  • Glow discharge
  • Ion Gun for pre-cleaning or assisted evaporation
  • Different sizes and number of crucibles
  • Substrate heating
  • Gas inlet
  • Several combinations of substrate holders/ manipulators
  • Vertical movement of substrate up to 350mm to reduce cost of materials in case of precious elements (Gold, Platinum, etc.) by reducing distance source to substrate.

SPUTTERING CHAMBER ALTERNATIVE CONFIGURATIONS:

  • 3 different standard sizes of magnetron sputtering targets: 2", 3" and 4"
  • Configured DC, DC pulsed and/or RF power supplies
  • Co-Sputtering facilities
  • Moisture trap (purifier) in gas lines
  • Substrate heating
  • Additional gases inlets