Multi-Chamber Vacuum Cluster Tool

TFDS-550C is a multi-chamber vacuum cluster tool is capable to integrate up to 7 process modules including but not only:

  • Load lock/s for loading/unloading
  • Metal and organic deposition
  • Thermal treatment chambers
  • Masks storage chamber


  • Processing of substrates up to 200x200 mm, and larger.
  • Fully automated robotic sample transfer system
  • Face down design if evaporation is required
  • Rectangular gate valves to separate modules from robot chamber
  • Totally dry pumping system
  • Rotating / positioning substrate holders
  • Mask Changing/Storage Module for up to 20 masks
  • Base pressure ≤ 5 · 10-7 mbar
  • PLC/PC fully automated process control

Deposition Techniques Available:

  • Thermal Evaporation, includes RADAK sources
  • Electron Beam Evaporation
  • Ion Beam Assisted E.B. Evaporation
  • Flash Evaporation
  • Magnetron Sputtering (RF, DC, Pulsed DC and HIPIMS)
  • Organic Evaporation, available with up to 8 Low Temperature Evaporation
  • Inductive Coupled Plasma
  • Laser Ablation
  • Pulsed Laser Deposition
  • Ion Beam Sputtering
  • Ion Beam Etching

Process Options:

  • Heating
  • Cooling
  • Ion Source Cleaning
  • Reactive Plasma Surface Activation
  • Reactive Gases Partial Pressure
  • Progressive Mask