DUAL CHAMBER THIN FILM DEPOSITION SYSTEM TFDS-462U

The TFDS-462U features 2 process chambers (module A and B) and one transfer chamber (module C), that serves as a load-lock. Built on a single self-contained frame, with “Through the Wall” design, the TFDS-462U perfectly fits cleanrooms and clean production floor environments. It is fully assembled and shipped in one piece to decrease installation time and provide comprehensive solution in the smallest available footprint essential for clean room and production application.

Module A:

High Vacuum Evaporation System

  • E-gun process chamber
  • 4 to 8 material pockets
  • Ion Gun for pre-cleaning
  • Assisted evaporation
  • Stainless steel water-cooled chamber
  • Built-in vacuum pumping system
  • High temperature substrate holder

Module B:

High Vacuum Sputtering System

  • Up to 6 sputtering magnetrons
  • ICP ion-assist source, that can be also used for pre-cleaning
  • Built-in vacuum pumping system
  • Two interchangeable substrate holders, cooled or heated

Module C:

Transfer / Load-lock System

  • Handles up to 8-inch diameter substrates
  • Up to 300 mm wafers – an option
  • Direct in vacuum loading in any of the chambers
  • Substrates transfers in vacuum from one to chamber another

ALTERNATIVE CONFIGURATIONS:

  • Two evaporation chambers
  • Two sputtering chambers
  • Organic materials deposition chamber with up to eight low temperature evaporation / LTE sources in any combination
  • Turbomolecular pumps or cryogenic pumps
  • With and without transfer chamber
  • Size and quantity of substrates according to client request

EVAPORATION CHAMBER ALTERNATIVE CONFIGURATIONS:

  • Additional thermal evaporation sources
  • Glow discharge
  • Different sizes and number of crucibles
  • Additional gas inlets
  • Substrate cooling
  • Several combinations of substrate holders/ manipulators
  • Vertical movement of substrate up to 300mm to reduce cost of materials in case of precious elements (Gold, Platinum, etc.) by reducing distance source to substrate.

SPUTTERING CHAMBER ALTERNATIVE CONFIGURATIONS:

  • 3 different standard sizes of magnetron sputtering targets: 2", 3" and 4"
  • DC, pulsed DC and/or RF power supplies
  • Co-Sputtering facilities
  • Additional gas inlets