Compact Sputtering Systems

Next generation sputtering deposition systems series TFDS-840, 842 are flexible completely customizable magnetron sputtering systems designed specifically for R&D and prototype production. Multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum and reactive sputtering (with active gas mixtures) are possible.

TFDS-842 is the most compact sputtering system with minimal footprint, while TDFS-840 is a compact-configuration with a load-lock chamber.


  • Electro-polished stainless-steel chamber (D shaped Box)
  • 4” Diameter viewport on front door with manual shutter
  • Additional spare ports/ flanges for future upgrades
  • Dry scroll pump (per request - dual stage rotary vane pump)
  • Cryo pumping or turbo-molecular vacuum pumping system
  • Cold-cathode or hot cathode ionization gauge
  • Throttle gate-valve

Load-lock with:

  • Manual/automatic sample transfer system
  • UV cleaning
  • Controlled oxygen inlet
  • Sample rotation
  • Sample controlled heating/cooling
  • Pneumatically operated gate-valve
  • Turbo-molecular pumping-system
  • Single/multiple magnetron gun assemblies with various target sizes
  • The stand-alone guns with special mounting enable angular and high adjustment
  • Targets are indirect cooled
  • Cooling water is not in contact with the magnets or with applied cathode power
  • DC / RF sputtering deposition of magnetic, non-magnetic metals or insulators
  • Easy target mounting
  • DC, DC pulsed, RF or HiPIMS power supplies
  • Blocked filters for DC power supplies
  • High-voltage switch box
  • Motorized shutter assembly for each source
  • Up to 4-gas inlets with mass flow controllers
  • Substrate pre-cleaning by Ion-source
  • Substrate rotation
  • Substrate heater (from RT up to 800°C)
  • Programmable adjustable substrate height before or during deposition (Z-shift)
  • PC /PLC controlled system