MAGNETRON SPUTTERING DEPOSITION SYSTEMS

Using all known sputtering modes including RF, DC, pulsed DC and HIPIMS, VST sputtering deposition systems can be used in reactive and non-reactive modes.

VST sputtering deposition systems can contain up to 6 sources in a planar or co-sputtering sputter-up or sputter-down modes, with adjustable sputter angles and substrate to source distances. They feature customized RF biased substrate holders, with or without a load lock chamber and linear transfer mechanism. They can be fitted with Ion beam sources for pre-cleaning or ion assisted deposition. A completely automated process control system is furnished to ensure a reliable, repeatable and high-quality coating process.

Our sputtering systems may be designed to include additional electron-beam/thermal evaporation sources in the same chamber in two adjacent chambers that are served through a centrally located transfer/load lock chamber....

Our systems include small footprint R&D systems, mid-size single chamber versatile multi-process systems, large dual-chamber multi process systems, multichambered cluster tools and glove-box integrated systems.

MAGNETRON SPUTTERING SYSTEMS:

We obtained quite immediately excellent process results on all layers that we had planned to grow using this equipment. The equipment has been running on a daily basis, and we have so far encountered no failure, and this is explained by the fact that the components of the system are of very high quality.

Dr Olivier BRIOT

Director of Research – CNRS - National Center for Scientific Research

University of Montpellier, France